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UV and fiber lasers for PCB prototyping, via drilling, and production from LPKF and SÜSS MicroTec. Compare wavelength (355nm/532nm), minimum feature size, and throughput for flex/rigid boards.
UV lasers (355nm) are essential for fine-feature PCB work — via drilling down to 25µm, trace cutting without thermal damage to adjacent copper, and controlled-depth ablation on multilayer boards. IR fiber lasers handle larger via drilling and depaneling where thermal budget is less critical.
Prototyping systems prioritize flexibility and small-batch changeover time. Production systems focus on holes-per-second throughput (typically 500–2000 vias/second for UV systems) and automated panel handling. Choose based on your volume: <100 panels/day favors prototyping platforms.
Use category pages for equipment discovery, then validate power, cutting speed, production time, gas consumption, and per-part cost.