3D-Micromac
microDICE
0.05kW Solid
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3D-Micromac microDICE
0.05kW Solid cutting Machine
0.05 kW
300×300mm
Germany
±0.001mm
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How It Compares
Compared against 34 machines in this category
Overview
Laser dicing system for semiconductor wafer processing, stealth dicing and ablation modes, for silicon, SiC, GaN, glass wafers.
Market Position
Power vs. work area compared to 14 machines in this category
Full Specifications
Laser System
| Brand | 3D-Micromac |
| Model | microDICE |
| Laser Type | Solid |
| Power Output | 0.05 kW |
| Wavelength | 355 nm |
Work Envelope
| Work Area (L × W) | 300 × 300 mm |
| Positioning Accuracy | ±0.001 mm |
Machine Specifications
| Weight | 2000 kg |
| Power Consumption | 5 kW |
Commercial Information
| Country of Origin | DE |
| Price Range | $300,000 - $600,000 |
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Frequently Asked Questions
Common questions about the 3D-Micromac microDICE
The 3D-Micromac microDICE features a 0.05kW solid laser, suitable for metal cutting and sheet processing.
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